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Mass transport limited growth in CVD. Adapted from H. O. Pierson, Handbook of Chemical Vapor Deposition , Noyes Publications, Park Ridge (1992).

Feed rate limits the deposition when nearly all the reactant is consumed in the chamber. The feed rate is more important for a hot wall reactor since the heated walls will decompose a large amount of the precursor. Cold wall reactors tend to have higher deposition rates since the reactants are not depleted by the walls.

A plot of growth rate versus temperature, known as an Arrhenius plot, can be used to determine the rate limiting step of a reaction ( [link] ). Mass transport limits reactions at high temperatures such that growth rate increases with partial pressures of reactants, but is constant with temperature. Surface reaction kinetics dominates at low temperatures where the growth rate increases with temperature, but is constant with pressures of reactants. Feed rate limited reactions are independent of temperature, since it is the rate of gas delivery that is limiting the reaction. The Arrhenius plot will show where the transition between the mass transport limited and the surface kinetics limited growth occurs in the temperature regime.

Dependence of CVD deposition rate on temperature. Adapted from J. G. Eden, in Thin Film Processes II , Eds. J. L. Vossen and W. Kern, Academic Press, New York (1991).

Increases in reactant concentrations will to a point increase the deposition rate. However, at very high reactant concentrations, gas phase nucleation will occur and the growth rate will drop ( [link] ). Slow deposition in a CVD reactor can often be attributed to either gas phase nucleation, precursor depletion due to hot walls, thick boundary layer formation, low temperature, or low precursor vapor pressure.

Demonstration of deposition rate on reactant concentration for CVD deposition. Adapted from J. G. Eden, in Thin Film Processes II , Eds. J. L. Vossen and W. Kern, Academic Press, New York (1991).

Cvd systems

Precursor delivery

Flow of reactants into the reactor must be closely monitored to control stoichiometry and growth rate. Precursor delivery is very important since in many cases the flow rate can limit the deposition. For low vapor pressure solids, a carrier gas is passed over or through a bed of the heated solid to transport the vapor into the reactor. Gas flow lines are usually heated to reduce condensation of the vapor in the flow lines. In the case of gas precursors, mass flowmeters easily gauge and control the flow rates. Liquid precursors are normally heated in a bubbler to achieve a desired vapor pressure ( [link] ).

Schematic representation of a bubbler for liquid precursors.

An inert gas such as hydrogen is bubbled through the liquid and by calculating the vapor pressure of the reactant and monitoring the flow rate of the hydrogen, the flow rate of the precursor is controlled by using [link] , where Q MO is the flow rate of the metal-organic precursor, Q H2 is the flow rate of hydrogen through the bubbler, P MO is the vapor pressure of the metal-organic at the bubbler temperature, and P B is the pressure of the bubbler.

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Source:  OpenStax, Chemistry of electronic materials. OpenStax CNX. Aug 09, 2011 Download for free at http://cnx.org/content/col10719/1.9
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